COB (Chip on Board) packaging technology is a very advanced semiconductor chip packaging technology that assumes an impressive position in the display field. Compared to other packaging options, COB technology has some unique advantages, which are described below in close relationship with Milestrong's COB family of products MCOB, UCOB, and SCOB Series.

First, COB packaging technology can raise the brightness and contrast of the display conspicuously. Because, in the previous SMD technology, each chip should be installed individually on the PCB when packaging the LED chip, COB technology fixes the bare chip directly onto the board. This technology reduces the distance between chips and hence centralizes the light source, which improves overall the brightness and contrast of the display. Such as Milestrong's MCOB series products, whose pixel pitches range from 0.93mm to 1.87mm, with high definition and brightness.

The second point is that COB technology can provide better performance in heat dissipation. As the LED chip is directly adhered to the substrate with good thermal conductivity, the heat can be quickly conducted and dissipated. Compared with an SMD package, more intermediate media are needed. This will make the COB LED display not easy to be overheated after a long time of use, thus prolonging the service life of the product. For example, the UCOB series from Milestrong features a cabinet size of 800*337.5*38mm with good heat dissipation and a display of stability.

Third, COB technology has stronger protection performance. COB packaging technology: through the solidification and sealing process, the LED chip is totally wrapped up under the layer of protection. It effectively avoids the impact of the external environment on the chip. It has good waterproofing, dustproofing, and resistance to impacts. Therefore, it allows COB LED screen displays to be used in more demanding environments without being easily damaged. SCOB series, manufactured by Milestrong, enjoys widespread usage indoors owing to its protection superiority and a pixel pitch that ranges from 0.625mm to 1.56mm.

Last but not least, there is more integration and flexibility in design. With the simplification of the COB package in circuit design and manufacturing, it integrates more functional components in a small area and improves the display integration and reliability. No matter for commercial display, command and control room, or conference room, COB displays are able to be flexibly customized according to specific needs with diverse requirements of different application scenarios.

In general, the development direction of COB packaging technology is an important trend in high brightness, high contrast, excellent heat dissipation performance, and strong protection in the display field. Using this advanced technology, Milestrong created the series products of MCOB, UCOB, and SCOB, with outstanding performance and a wide range of applications. In the future, along with unremitting innovation and progress of technology, COB packaging technology will give full play to its unique advantages in many fields and present a visual shock for users.