As one of the important innovations in the LED display industry, COB technology is leading the development direction of the industry with its unique advantages and wide application prospects. We have reason to believe that in the future, COB technology will bring us more wonderful visual feast and a more convenient and efficient lifestyle.

In the LED display market, DIP and SMD packaging technologies have long dominated. However, with the continuous progress of technology and the increasingly diversified market demand, these two traditional packaging technologies have gradually exposed problems that are difficult to break through. In order to seek new breakthroughs, domestic LED display manufacturers have invested in research and development, and finally brought COB packaging technology to the market. The emergence of this technology has undoubtedly brought new development opportunities for the LED display industry.

COB packaging technology, as an advanced packaging technology that fixed the LED light-emitting chip on the PCB substrate and then attached the adhesive as a whole, has the characteristics of moisture proof, anti-static, anti-bump and so on, greatly reducing the phenomenon of dead lights, and becoming the appropriate technical route in the mini era.

The core is to adhere the bare chip directly to the PCB board, realize the electrical connection between the chip and the substrate through the lead bonding technology, and finally encapsulate the chip and the lead with resin adhesive to form a complete display unit. Compared with the traditional SMD package, COB package technology eliminates the manufacturing and welding of lamp beads, greatly simplifies the packaging process, and the heat dissipation performance is also significantly improved.

Milestrong's COB series, which includes the MCOB, UCOB, and SCOB series, represents a major advancement in LED display technology with the following features:
Ultra-thin and light: according to customer needs, PCB boards of different thicknesses can be used, reducing the weight to 1/3 of traditional products, significantly reducing structural, transportation and engineering costs.
Anti-collision and anti-pressure: the COB display LED chip is packaged in the concave position of the PCB board, with epoxy resin adhesive encapsulation and curing, the surface of the lamp point is raised into a surface, smooth and hard, anti-collision and wear-resistant.
Strong heat dissipation ability: through the copper on the PCB board, the heat of the wick is quickly transmitted, almost no serious light attenuation, greatly extending the service life.
Wear-resistant, easy to clean: the surface of the screen body is smooth and hard, crash-resistant and wear-resistant, the appearance of bad points can be repaired point by point, easy to clean.
High-definition display: the fine-pitch COB series provides amazing visual performance through ultra-high-definition display, ideal for applications that require sharp, bright and clear images, such as retail displays, live events, control rooms, meeting rooms, etc.

As one of the important innovations in the LED display industry, COB technology is leading the development direction of the industry with its unique advantages and wide application prospects. We have reason to believe that in the future, COB technology will bring us more wonderful visual feast and a more convenient and efficient lifestyle.